TY  - JOUR
AU  - Felic, G
AU  - Skafidas, S
Y2  - 2014/05/22
Y1  - 2009/01/01
SN  - 1536-1225
UR  - http://hdl.handle.net/11343/30370
LA  - English
PB  - IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
KW  - Communications Technologies
T1  - Flip-Chip Interconnection Effects on 60-GHz Microstrip Antenna Performance
DO  - 10.1109/LAWP.2009.2015436
IS  - IEEE Antennas and Wireless Propagation Letters
VL  - 8
SP  - 283-286
L1  - /bitstream/handle/11343/30370/279354_132591.pdf?sequence=1&isAllowed=n
ER  -